| Nano-Strip |
Aqueous |
• A positive and negative resist stripper
•
A pre-mixed sulfuric-peroxide mixture
•
Strong acidic and oxidizing chemistry
•
A safer and cost-effective alternative to Piranha
•
Low controlled Al etch rate
•
Other metals should be tested for etch rates
•
Mask, FPD and wafer applications
•
Room temp. to 70?C typical operations |
| RA-2 |
Semi-aqueous |
• Positive resist stripper
•
Inorganic alkali and solvent blend
•
Mask application
•
Room temp. process |
| RS-6 |
Semi-aqueous |
• Positive resist stripper
•
Organic alkaline
•
Cost effective and easily disposable
•
Moderate strip speed
•
Better suited for spray applications
•
Mask and FPD application
•
Room temp. process |
| RS-41 |
Semi-aqueous |
• Positive resist Stripper
•
Inorganic alkaline and solvent blend
•
Closely resembles RS-2
•
Mask application
•
Room temp. process |
| RSC-50 |
Solvent
|
• Positive resist stripper
•
Water soluble
•
Near neutral pH
•
Moderate strength
•
Wafer application, compatible with Cu and GaAs
•
Room temp. to 70?C operation |
| RS-100 |
Solvent |
• Positive resist stripper
•
Contains alkanolamines and surfactant
•
Water soluble
•
IPA post-rinse is highly recommended
•
Flash point = 112?C
•
A bulk stripper product for wafer fab applications
•
80-90?C process temperature |
| RS-111 |
Solvent |
• Positive resist stripper
•
An NMP replacement product
•
Non-corrosive
•
Water soluble
•
Moderate strength
•
Mask, FPD and wafer applications
•
Room temp. to 90?C operation |
| RS-112 |
Solvent |
• Positive resist stripper
•
RS-111 formulation with added DMSO
•
Slightly more potent than RS-111
•
Other features closely resemble RS-111 |
| RS-120 |
Solvent |
• Positive resist stripper
•
A robust non-corrosive product
•
Water soluble
•
High flash point = 143?C
•
Post-strip rinse is recommended, but not required
•
A potent bulk stripper for wafers
•
A specialized PBS stripper in mask making
•
Room temp. to 120?C operation |
| RS-122 |
Solvent |
• Positive resist stripper
•
Water soluble
•
No post-strip rinse required
•
Slightly acidic pH
•
Better suited for spray applications
•
Mask, FPD and wafer applications
•
Room temp. to 50?C operation |
| NRS-305 |
Solvent |
• Negative resist (polyisoprene) stripper
•
No phenols, chlorobenzenes, alkylbenzenes or naphthalene
•
Most effective for 1-4 ? resist thickness
•
Water insoluble
•
Requires acetone followed by IPA followed by a detergent rinse, ending
with DI water rinse and dry.
•
90-100?C operation |