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PHOTORESIST STRIPPERS

Cyantek offers strippers for mask, flat panel display and wafer applications. These products are formulated to strip both positive and negative resists and be compatible with different metal substrates including chrome, chrome oxide, tin oxide, silicon dioxide, silicon, gallium arsenide and copper. A brief synopsis of these products is displayed in the following table:


Product Mixture Description
Nano-Strip Aqueous • A positive and negative resist stripper
• A pre-mixed sulfuric-peroxide mixture
• Strong acidic and oxidizing chemistry
• A safer and cost-effective alternative to Piranha
• Low controlled Al etch rate
• Other metals should be tested for etch rates
• Mask, FPD and wafer applications
• Room temp. to 70?C typical operations
RA-2 Semi-aqueous • Positive resist stripper
• Inorganic alkali and solvent blend
• Mask application
• Room temp. process
RS-6 Semi-aqueous • Positive resist stripper
• Organic alkaline
• Cost effective and easily disposable
• Moderate strip speed
• Better suited for spray applications
• Mask and FPD application
• Room temp. process
RS-41 Semi-aqueous • Positive resist Stripper
• Inorganic alkaline and solvent blend
• Closely resembles RS-2
• Mask application
• Room temp. process
RSC-50 Solvent
• Positive resist stripper
• Water soluble
• Near neutral pH
• Moderate strength
• Wafer application, compatible with Cu and GaAs
• Room temp. to 70?C operation
RS-100 Solvent • Positive resist stripper
• Contains alkanolamines and surfactant
• Water soluble
• IPA post-rinse is highly recommended
• Flash point = 112?C
• A bulk stripper product for wafer fab applications
• 80-90?C process temperature
RS-111 Solvent • Positive resist stripper
• An NMP replacement product
• Non-corrosive
• Water soluble
• Moderate strength
• Mask, FPD and wafer applications
• Room temp. to 90?C operation
RS-112 Solvent • Positive resist stripper
• RS-111 formulation with added DMSO
• Slightly more potent than RS-111
• Other features closely resemble RS-111
RS-120 Solvent • Positive resist stripper
• A robust non-corrosive product
• Water soluble
• High flash point = 143?C
• Post-strip rinse is recommended, but not required
• A potent bulk stripper for wafers
• A specialized PBS stripper in mask making
• Room temp. to 120?C operation
RS-122 Solvent • Positive resist stripper
• Water soluble
• No post-strip rinse required
• Slightly acidic pH
• Better suited for spray applications
• Mask, FPD and wafer applications
• Room temp. to 50?C operation
NRS-305 Solvent • Negative resist (polyisoprene) stripper
• No phenols, chlorobenzenes, alkylbenzenes or naphthalene
• Most effective for 1-4 ? resist thickness
• Water insoluble
• Requires acetone followed by IPA followed by a detergent rinse, ending with DI water rinse and dry.
• 90-100?C operation


Nano-Strip and Nano-Strip 2X are registered trademarks of CYANTEK CORPORATION.
Copyright: September 2000